Velleman VTSDIR Manual de usuario descargar pdf (Pagina 6)

21

P

T

8

.

•

•

•

.03.2011

P

reparatio

n

The proced

• Switc

h

• Set ‘c

o

• Sort t

o

The followi

n

• SMT T

w

• Flux d

i

• Low s

o

T

emperatu

r

In normal

o

system is d

150W shor

t

maximum

o

In normal

u

provided b

y

Soldering

• PREPAR

A

centre

o

thickne

s

apply s

o

o [A]

P

o [B]

R

the c

duri

n

phas

e

o [C]

S

o [D]

C

Desolderi

n

• PREPAR

A

centre

o

o [A]

P

o [B]

R

the c

duri

n

time

o [C]

S

o [D]

C

Aftercare

• Clean fl

u

• Check s

o

• Test

.

Q&A

What Top

H

Betwee

n

What’s the

Approxi

m

Move th

compon

e

What pre-h

Betwee

n

n

ure for prep

h

on and wa

r

o

ntrol settin

g

o

ols and flu

x

n

g tools are

w

eezers, fin

i

spenser bo

t

o

lids and gel

r

e profile

o

peration th

e

esigned for

t

wave IR la

m

o

f 650W me

d

u

se, approxi

m

y

the back h

A

TION: plac

o

f the PCB p

r

s

s). Place an

o

lder paste t

o

P

REHEAT th

e

R

EFLOW: us

e

omponent u

n

g the reflo

w

e

time (nor

m

S

OAK for a

s

C

OOL: allow

n

g

A

TION: plac

o

f the PCB p

r

P

REHEAT th

e

R

EFLOW: us

e

omponent u

n

g the reflo

w

(normally 3

S

OAK for a

s

C

OOL – allo

w

u

x residue o

f

o

lder joints

H

eat setting

n

220 and 3

8

working dis

t

m

ately 5~1

0

e hand tool

e

nt.

eater settin

g

n

200 and 2

9

aring to re

w

r

m up.

g

s’ required

x

es required

.

required fo

r

e tipped

t

tle

/paste flux

e

componen

t

rework sing

m

p focused

d

ium wave

I

m

ately 25%

eater (pre-

h

e the PCB i

n

r

e-heater. F

o

d align com

p

o

the PCB b

e

e

fluxed co

m

e

the IR ha

n

p to reflow

t

w

phase so t

h

m

ally 30-45

s

hort period

the compo

n

e PCB in th

e

r

e-heater. A

p

e

fluxed co

m

e

the IR ha

n

p to reflow

t

w

phase so t

h

0-45 secon

d

s

hort period

w

the comp

o

f

f PCB if ne

c

should you

u

8

0°C. Norm

a

t

ance of the

0

mm when

in a scannin

g

should I u

s

9

0°C. Norm

a

w

ork SMT/B

G

for PCB/co

m

.

r

use in sold

e

t

is first put

le/double si

d

through a r

e

I

R.

of the ener

g

h

eater). Figu

n

the PCB h

o

o

r BGAs, ap

p

p

onent. No

t

e

fore placin

g

m

ponent/PC

B

n

d tool (ope

r

t

emperatur

e

h

erefore we

seconds for

soak (abou

t

n

ent to cool

e

PCB holde

r

p

ply a very

s

m

ponent/PC

B

n

d tool (ope

r

t

emperatur

e

h

erefore we

d

s for a sma

l

soak (abou

t

o

nent to coo

c

essary

u

se?

a

l setting is

IR Hand to

o

reworking a

g motion to

s

e?

a

l setting is

VTSDIR

6

G

A compone

n

m

ponent

e

ring/desol

d

through a

p

d

e and mix

e

e

flective ch

a

g

y is prove

d

re below sh

o

o

lder, positi

o

p

ly a very s

m

t

e – dependi

g

componen

t

B

to approxi

m

r

ated by pre

e

(200-225°

C

use the tim

e

a small PC

B

t

10 second

s

to below 18

r

, positionin

g

s

mall amou

n

B

to approxi

m

r

ated by pre

e

(200-225°

C

use the tim

e

l

l PCB).

t

10 second

s

l to below 1

8

240°C.

o

l and how

d

nd move up

heat leads,

240°C.

n

ts is as foll

o

d

ering opera

t

p

reheat stag

e

d technolog

y

a

mber syste

m

d

by the top

o

ws how th

e

ning the co

m

m

all amount

ng on the a

p

t

.

m

ately 120°

C

ssing the fo

o

C

). It is not

e

r on the IR

B

).

s

) the comp

o

0°C before

m

g

the compo

n

n

t of flux un

d

m

ately 120°

C

ssing the fo

o

C

). It is not

e

r on the IR

8

s

) the comp

o

8

0°C before

d

o I move it

to 30mm

w

taking abo

u

o

ws:

t

ions:

e

, followed

b

y

PCB. The

t

m

. The bott

o

heater, and

e

energy is

a

m

ponent sit

e

of gel flux

(

p

plication, y

C

(as meas

u

o

tswitch) fo

r

so easy to

m

810 control

o

nent allowi

n

m

oving the

P

n

ent site to

d

er/around

t

C

(as meas

u

o

tswitch) fo

r

so easy to

m

8

10 controll

e

o

nent allowi

n

moving the

for rework?

w

hen removi

n

u

t one secon

b

y a reflow

s

t

op heat is

d

o

m heater d

e

75% of the

a

pplied to a

c

e

to be rew

o

(

approx. 0.1

y

ou may be

r

u

red by the

I

r

the reflow

m

easure te

m

ler to limit t

n

g the joint

s

P

CB.

be reworke

d

t

he compon

e

u

red by the

I

r

the reflow

m

easure te

m

er to limit t

h

n

g the joint

s

PCB.

n

g compone

d for each s

c

©Vellema

n

s

tage. The

d

erived from

e

livers a

energy is

c

omponent.

rked over t

h

- 0.15mm)

r

equired to

I

R sensor).

phase to he

a

m

perature

he reflow

s

to fully bo

n

d

over the

e

nt.

I

R sensor).

phase to he

a

m

perature

h

e reflow ph

a

s

to fully bo

n

nts.

c

an of the

n

nv

a

h

e

a

t

n

d.

a

t

a

se

n

d.

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